Gold Strike Brush and Tank (UK and EU only) 50ml
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23.89
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This plating solution can be used for both brush and tank plating very adhesive layers on to difficult-to plate metals such as chrome, surgical steel and dental alloys and tungsten. When brush plating, all swabs can be used with this solution, however for longer life we recommend using S-Type Swabs which can be purchased by clicking on the link in the ‘Related Products’ section below this panel.
It is primarily used as an adhesive undercoat for other metals such as gold, silver, palladium and platinum and should not be plated to a thickness of over 0.1 micron.
Brush plating voltage: 3 – 4 volts
Plating Factor (tank): 0.03 amp/cm2 (see Tech Specs)
Gold concentration: 2 grams per litre
Operating conditions and deposit data for brush plating
| Voltage | 3 – 4 volts |
| Temperature | 20 – 25 °C (see notes) |
| Gold Concentration | 2 g/l |
| Electrode | Carbon or platinum |
| Gold content in plate | 99% – 99.5% |
| Plating Rate at (3 volts, Carbon Electrode, 20 °C) | 0.07 micron per minute (spot) |
| Plating Rate at (4 volts, Carbon Electrode, 20 °C) | 0.09 micron per minute (spot) |
| Recommended plating thickness | 0.1 micron |
| Coverage | 10ml will cover 80 cm2 to 0.1 micron |
| Hardness | 185 Hv |
| Density of deposit | 19.3 g/cm3 |
| Stress | Not known |
| Special storage requirements | Away from sunlight |
| Shelf life | 1 – 2 years |
| Health and Safety classification | Harmful |
| Special considerations | None |
| Transport (UN number) | 2796 |
Notes:
- When plating in recesses, we recommend using the using the Plating Pen (8 – 10 volts, Fibre Nib).
Or consider using Gold Strike Pen Plating Solution. - Plating rate decreases considerably below 20 °C
- We strongly advise against the use of stainless steel anodes for most of our plating processes
- Plating rates are calculated over a sample area which is permanently covered by swab.
Operating conditions and deposit Data for tank plating
| Plating Factor | 0.01 to 0.04 A/cm2 (recommended: 0.03 A/cm2) |
| Plating rate at 0.01 A/cm2 | 0.02 micron per minute (at 30°C) |
| Plating rate at 0.02 A/cm2 | 0.07 micron per minute (at 30°C) |
| Plating rate at 0.03 A/cm2 | 0.10 micron per minute (at 30°C) |
| Plating rate at 0.04 A/cm2 | 0.11 micron per minute (at 30°C) |
| Recommended plating thickness | 0.1 micron (about 1 minute process time) |
| Temperature | 18 – 40 °C |
| pH | ~ 1.0 |
| Gold concentration | 2 grams per litre |
| Agitation | None |
| Electrode | Mesh |
| Gold content in plate | 99.9% (balance carbon, nitrogen) |
| Cathode efficiency | 5% at Plating Factor = 0.03A/cm2 |
| Hardness | 190 – 210 Hv |
| Density of deposit | 19.3 g/cm3 |
| Stress | Medium |
| Special storage requirements | Away from sunlight |
| Shelf life | 1 – 2 years |
| Health and Safety classification | Harmful |
| Special considerations | None |
| Transport (UN number) | 2796 |
Notes:
- Plating rate and throwing power increase considerably with temperature.
- For recessed items consider increasing the temperature up to 40 °C and Plating Factor up to 0.10 A/cm2
for one minute.